QCC740: New Tri-Radio Chipsets
Comprehensive On-Chip Features on QUALCOMMs IoT Chipset
Following the introduction of the Wi-Fi4 IoT solutions QCC730, QUALCOMM takes another step forward with the brand-new QCC740 family: In addition to Wi-Fi6, it also offers Bluetooth 5.3 and IEEE 802.15.4 (Zigbee, Thread).
DOWNLOAD DATASHEET SAMPLESHOPWide Range of Features
Unlike conventional tri-radio combination chipsets on the market, the new QCC740 family is offered with a wide range of on-chip features, including a powerful 32-bit RISC-V processor (FPU + DSP) @325 MHz with 48KB cache, 484KB SRAM and 128KB ROM, as well as optional 4/8/16MB pSRAM and 8MB NOR Flash System-in-Package (SiP).
In addition, the new device family offers multimedia functions such as audio/video codecs and interfaces and 35-fold multiplexed GPIOs that support many digital but also analogue interfaces such as QSPI, SDIO, SD card, SPI, UART, I2C, I2S, PWM, 12-bit ADC, 12-bit DAC, ACOMP, IR remote, RMII (10/100 Ethernet), CAN (ISO11898) and USB 2.0 OTG.
Security Services
The integrated security engine also supports numerous security services such as Secure Boot/Debug, Hash, AES, True Random Number Generation (TRNG), Trusted Execution Environment (TEE), On-the-Fly AES Decryption (OTFAD) and Public Key Accelerator.
This all-in-one design approach and the resulting features make this device family an attractive choice for applications where high performance and security are required at reduced cost, such as smart appliances, industrial IoT, smart home devices, medical devices and IoT hubs/gateways.
Various Versions of QCC-740
In order to meet as many of these applications as possible, QUALCOMM offers various versions that differ in the following characteristics:
- Housing: [QFN-56, 7x7x0.9mm, 0.4mm pitch] or [QFN-40, 5x5x0.9mm, 0.4mm pitch]
- pSRAM: 0/4/8/16MB
- Flash: 0/4/8MB
- Temperature range: -40 to 105°C or -40 to 85°C
Your Contact Person
For more information, please contact André Ehlert.
